© Semiconductor Components Industries, LLC, 2016

September, 2016 − Rev. 10

1

Publication Order Number:

NTD3055L104/D

NTD3055L104,

NTDV3055L104

Power MOSFET

12 A, 60 V, Logic Level N−Channel

DPAK/IPAK

Designed for low voltage, high speed switching applications in power

supplies, converters and power motor controls and bridge circuits.

Features

Requiring Unique Site and Control Change Requirements;

AEC−Q101 Qualified and PPAP Capable

Typical Applications

Rating

Symbol

Value

Unit

Drain−to−Source Voltage

60

Vdc

60

Vdc

Gate−to−Source Voltage, Continuous

"15

"20

Vdc

Drain Current

12

10

45

Adc

Apk

Derate above 25

°C

48

0.32

2.1

1.5

W

W/

°C

W

W

Operating and Storage Temperature Range

− 55 to

+175

°C

Single Pulse Drain−to−Source Avalanche

61

mJ

Thermal Resistance, − Junction−to−Case

− Junction−to−Ambient (Note 1)

− Junction−to−Ambient (Note 2)

3.13

71.4

100

°C/W

Maximum Lead Temperature for Soldering

Purposes, 1/8

″ from case for 10 seconds

260

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. When surface mounted to an FR4 board using 1

″ pad size,

2. When surface mounted to an FR4 board using the minimum recommended

N−Channel

D

S

G

60 V

104 m

W

12 A

See detailed ordering and shipping information in the package

dimensions section on page 7 of this data sheet.

ORDERING INFORMATION

1

Gate

3

Source

2

Drain

4

Drain

DPAK

CASE 369C

STYLE 2

MARKING DIAGRAMS

& PIN ASSIGNMENTS

1 2

3

4

1

Gate

3

Source

2

Drain

4

Drain

IPAK

CASE 369D

STYLE 2

1

2

3

4

A

= Assembly Location*

55L104

= Device Code

Y

= Year

WW

= Work Week

G

= Pb−Free Package

www.onsemi.com

* The Assembly Location code (A) is front side

optional. In cases where the Assembly Location is

stamped in the package, the front side assembly

code may be blank.