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CB028B0563 датащи(PDF) 5 Page - AVX Corporation

номер детали CB028B0563
подробное описание детали  Film Chip Capacitors
Download  8 Pages
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производитель  AVX [AVX Corporation]
домашняя страница  http://www.avx.com
Logo AVX - AVX Corporation

CB028B0563 датащи(HTML) 5 Page - AVX Corporation

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Film Chip Capacitors
PPS DIELECTRIC – CB Series
MOUNTING AND SOLDERING RECOMMENDATIONS
RECOMMENDED SOLDER PASTE THICKNESS
For optimum solderability, the recommended soldering
paste thickness: 1206 to 1812 :150 to 200μm
In case of hand soldering, the temperature of the soldering
iron should not be above 250°C. Special care must be taken
to avoid touching the capacitor body with the iron tip.
RECOMMENDED CLEANING
To clean flux from the PC board assembly, the recommended
products are: ethanol, isopropyl alcohol, and deionized water
wash. The cleaning products to avoid are: Toluene, Xylene,
Trichloroethylene, Terpene Cleaner EC-7, surface active
agent. In case of using another solvent, please contact us.
OTHER CAUTIONS
Flame retardancy: the dielectric film is not a flame retardant
material.
Environment: contact us when chips are used in humid or
gas atmosphere and /or when using resin.
Recommended handling: do not use edged tools, so not
to damage the capacitors.
TIN WHISKERS TESTS : JEDEC STANDARD NO 22A121
Stress Type
Ref. Spec.
Test Conditions
Analysis
Results
Temperature cycling
JESD22-A104
-55°C +85(+10/-0)°C air
SEM x 1000
Pass
5 to 10 minutes soak 3 cycles/hour
Ambient Temperature /
30+/-2°C - 60+/-3% RH -2000H
SEM x 1000
Pass
Humidity Storage
High Temperature /
70+/-5°C - 93+3/-2% RH -1000H
SEM x 1000
Pass
Humidity Storage
Size Code
Case Size
A
B
C
01
1206
1.30 (0.051)
1.30 (0.051)
2.20 (0.087)
02
1210
2.00 (0.079)
1.30 (0.051)
2.20 (0.087)
03
1812
3.00 (0.118)
1.50 (0.059)
3.50 (0.137)
PAD DIMENSIONS: millimeters (inches)
A
CB
*Reflow soldering referring to JEDEC Standard with some limitations
*JEDEC J-Std 020C
SOLDERING PROFILE
The capacitors can be mounted using infrared and vapor phase soldering following recommended below.
They are NOT suitable for wave soldering.
All temperature refer to topside of the package, measured on the package body surface.
Profile Feature
1206 to 1812
Ramp-Up (Ts max to Tp)
3°C / second max
Preheat
- Temperature Min (Ts min)
150°C
- Temperature Min (Ts max)
200°C
- Time (ts min to ts max)
180 sec. max
Time maintained above
- Temperature (TL)
217°C
- Time (tL)
90 sec. max
Peak temperature (Tp)
260°C
Time within 5°C of peak
10 sec.
temperature (tp)
Ramp-Down
6°C / sec.
030
Time (seconds)
60
90
120 150 180 210 240
Ramp
down
Ramp up
270 300 330
Tp
Tp - 5ºC
Ts min
Ts max
TL
tS
tp
tL


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