поискавой системы для электроныых деталей |
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TPA2016D2 датащи(PDF) 5 Page - Texas Instruments |
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TPA2016D2 датащи(HTML) 5 Page - Texas Instruments |
5 / 46 page 5 TPA2016D2 www.ti.com SLOS524E – JUNE 2008 – REVISED MAY 2016 Product Folder Links: TPA2016D2 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted). (1) MIN MAX UNIT VDD Supply voltage AVDD, PVDDR, PVDDL –0.3 6 V Input voltage SDZ, INR+, INR–, INL+, INL– –0.3 VDD + 0.3 V SDA, SCL –0.3 6 Continuous total power dissipation See Dissipation Ratings TA Operating free-air temperature –40 85 °C TJ Operating junction temperature –40 150 °C RLOAD Minimum load resistance 3.2 Ω Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 7.3 Recommended Operating Conditions MIN MAX UNIT VDD Supply voltage AVDD, PVDDR, PVDDL 2.5 5.5 V VIH High-level input voltage SDZ, SDA, SCL 1.3 V VIL Low-level input voltage SDZ, SDA, SCL 0.6 V TA Operating free-air temperature –40 +85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) TPA2016D2 UNIT YZH (DSBGA) RTJ (QFN) 16 PINS 20 PINS RθJA Junction-to-ambient thermal resistance 71 33.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.4 22.5 °C/W RθJB Junction-to-board thermal resistance 14.4 9.6 °C/W ψJT Junction-to-top characterization parameter 1.9 0.2 °C/W ψJB Junction-to-board characterization parameter 13.6 9.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — 2.4 °C/W |
Аналогичный номер детали - TPA2016D2 |
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Аналогичное описание - TPA2016D2 |
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