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TPA3111D1

SLOS618F – AUGUST 2009 – REVISED JULY 2016

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Copyright © 2009–2016, Texas Instruments Incorporated

Pin Functions (continued)

PIN

I/O

DESCRIPTION

NAME

NO.

OUTP

18

O

Class-D H-bridge positive output.

OUTP

20

O

Class-D H-bridge positive output.

OUTN

23

O

Class-D H-bridge negative output.

OUTN

25

O

Class-D H-bridge negative output.

PGND

24

—

Power ground for the H-bridges.

PGND

19

—

Power ground for the H-bridges.

PLIMIT

10

I

Power limit level adjust. Connect directly to GVDD pin for no power limiting. Add a 1-µF capacitor to

ground at this pin.

PVCC

15

P

Power supply for H-bridge. PVCC pins are also connected internally.

PVCC

16

P

Power supply for H-bridge. PVCC pins are also connected internally.

PVCC

27

P

Power supply for H-bridge. PVCC pins are also connected internally.

PVCC

28

P

Power supply for H-bridge. PVCC pins are also connected internally.

SD

1

I

Shutdown logic input for audio amplifier (LOW = outputs Hi-Z, HIGH = outputs enabled). TTL logic levels

with compliance to AVCC.

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The voltage slew rate of these pins must be restricted to no more than 10 V/ms. For higher slew rates, use a 100-kΩ resistor in series

with the pins.

(3)

The TPA3111D1 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected

to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection

shutdown. See Quad Flatpack No-Lead Logic Packages and QFN/SON PCB Attachment for more information about using the QFN

thermal pad. See PowerPad™ Thermally Enhanced package for more information about using the HTQFP thermal pad.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

AVCC, PVCC

–0.3

30

V

–0.3

V

<10

V/ms

PLIMIT

–0.3

V

INN, INP

–0.3

6.3

BTL

3.2

Ω

Continuous total power dissipation

See Thermal Information

–40

85

°C

(3)

–40

150

°C

–65

150

°C

(1)

In accordance with JEDEC Standard 22, Test Method A114-B.

(2)

In accordance with JEDEC Standard 22, Test Method C101-A

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±500