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TPS61165

SLVS790D – NOVEMBER 2007 – REVISED APRIL 2016

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Copyright © 2007–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground pin.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

20

V

–0.3

20

V

–0.3

3

V

–0.3

40

V

Continuous power dissipation

See Thermal Information

Operating junction temperature

–40

150

°C

Storage temperature

–65

150

°C

(1)

These values are recommended values that have been successfully tested in several applications. Other values may be acceptable in

other applications but should be fully tested by the user.

7.2 Recommended Operating Conditions

MIN

TYP

MAX

UNIT

Input voltage range, VIN

3

18

V

Output voltage range

38

V

L

10

22

μH

PWM dimming frequency

5

100

kHz

Input capacitor

1

μF

Output capacitor

1

10

μF

Operating ambient temperature

–40

85

°C

Operating junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

(2)

For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

7.3 Thermal Information

TPS61165

UNIT

DRV (WSON)

DBV (SOT-23)

6 PINS

6 PINS

R

Junction-to-ambient thermal resistance

80.7

210.1

°C/W

Junction-to-case(top) thermal resistance

55.4

46.8

°C/W

Junction-to-board thermal resistance

140.2

56.7

°C/W

Junction-to-top characterization parameter

0.3

0.5

°C/W

Junction-to-board characterization parameter

36.5

50.2

°C/W

Junction-to-case(bottom) thermal resistance

0.9

—

°C/W