поискавой системы для электроныых деталей |
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TPS6116XA датащи(PDF) 5 Page - Texas Instruments |
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TPS6116XA датащи(HTML) 5 Page - Texas Instruments |
5 / 31 page 5 TPS61160A, TPS61161A www.ti.com SLVS937C – MARCH 2009 – REVISED JULY 2016 Product Folder Links: TPS61160A TPS61161A Submit Documentation Feedback Copyright © 2009–2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) TPS61160A, TPS61161A UNIT DRV (WSON) 6 PINS RθJA Junction-to-ambient thermal resistance 140 °C/W RθJC(top) Junction-to-case (top) thermal resistance 20 (1) The JEDEC low-K (1s) board used to derive this data was a 3 in × 3 in, two-layer board with 2-ounce copper traces on top of the board. (2) The JEDEC high-K (2s2p) board used to derive this data was a 3 in × 3 in, multilayer board with 1-ounce internal power and ground planes and 2-ounce copper traces on top and bottom of the board. 6.5 Dissipation Ratings BOARD PACKAGE RθJC RθJA DERATING FACTOR ABOVE TA = 25°C TA < 25°C TA = 70°C TA = 85°C Low-K(1)DRV 20°C/W 140°C/W 7.1 mW/°C 715 mW 395 mW 285 mW High-K (2)DRV 20°C/W 65°C/W 15.4 mW/°C 1540 mW 845 mW 615 mW |
Аналогичный номер детали - TPS6116XA |
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Аналогичное описание - TPS6116XA |
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