4

TPS22970

SLVSDF2 – MAY 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

–0.3

4

V

Output voltage

–0.3

4

V

ON voltage

–0.3

4

V

PG voltage

–0.3

4

V

Maximum continuous switch current

4

A

Maximum pulsed switch current, pulse < 300-µs, 2% duty cycle

6

A

Maximum junction temperature

Internally Limited

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage

0.65

3.6

V

Output voltage

V

High-level input voltage, ON

0.9

3.6

V

Low-level input voltage, ON

0

0.45

V

Operating temperature

–40

125

°C

7

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TPS22970

UNIT

YZP (DSBGA)

8 PINS

Junction-to-ambient thermal resistance

130

°C/W

Junction-to-case (top) thermal resistance

54

°C/W

Junction-to-board thermal resistance

51

°C/W

Junction-to-top characterization parameter

1

°C/W

Junction-to-board characterization parameter

50

°C/W